ESC N8-E11v (H200)

Products\ NVIDIA HGX
DataSheet

7U NVIDIA HGX H200 8-GPU server with dual 5th Gen Intel Xeon Scalable processors that designed for large scale of AI and HPC, 10+1 or 12+1 PCIe slots, 32 DIMM, 10 NVMe, dual 10G LAN and optional OCP 3.0 socket.

End-to-End AI Supercomputing Platform NVIDIA HGX H200 8-GPU server

This 7U dual-socket server is powered by 5th Gen Intel Xeon® Scalable Processors and eight NVIDIA H200 Tensor Core GPUs. Designed to accelerate the development of AI and data science, ESC N8-E11 offers a dedicated one-GPU-to-one-NIC topology and supports up to eight NICs for the highest throughput during compute-intensive workloads. To reduce operating costs, the ASUS ESC N8-E11 is engineered to provide effective cooling and innovative components that deliver thermal efficiency, scalability, and unprecedented performance.

KEY FEATURES

  • Fueled by dual 5th Gen Intel® Xeon® Scalable processors, supporting 350W TDP
  • Direct GPU-to-GPU interconnect via NVLink delivers 900GB/s bandwidth for efficient scaling
  • A dedicated one-GPU-to-one-NIC topology: Supports up to 8 NICs for the highest throughput during compute-intensive workloads
  • Modular design with reduced cable usage: Shorten assembly time and improve thermal optimization
  • Advanced NVIDIA technologies: The full power of NVIDIA GPUs, BlueField-3, NVLink, NVSwitch, and networking
  • High level of power efficiency: 4+2 or 3+3 80 PLUS Titanium power supplies
  • Optimized thermal design: Supports direct-to-chip (D2C) cooling solution and features dedicated CPU and GPU airflow tunnels for efficient heat dissipation
  • Designed for generative AI with optimized server systems, data-center infrastructure, and AI software-development capabilities integrated by ASUS

Specifications

Processor / System Bus

2 x Socket

4th Gen Intel® Xeon® Scalable processors (Up to 350W)
5th Gen Intel® Xeon® Scalable processors (Up to 350W)

Core Logic

Intel® C741 Chipset

Memory

Total Slots:
32 (8 channel per CPU, 16 DIMM per CPU)
Capacity:
Maximum up to 4TB per CPU socket
Memory Type:
4th: DDR5 4400 RDIMM/ 3DS RDIMM (2DPC)
5th: DDR5 4400 RDIMM/ 3DS RDIMM (2DPC)
512GB, 256GB, 128GB Intel® Optane™ persistent memory 300 series
Memory Size:
64GB, 32GB, 16GB RDIMM
256GB, 128GB RDIMM 3DS

Expansion Slots

SKU1:
10 + 1 x PCIe Gen5 slots (1 x internal RAID card)

[PCIe Switch directly]
–  8 x PCIe Gen5 x16 link (LP, HL)
[CPU directly]
–  1 x PCIe Gen5 x16 link (FH, HL)* + 1 x PCIe Gen5 x16 link (FH, HL)* 

*Support DPU please choose SKU2


SKU2  (Launch in Dec. 2023)
12 x PCIe Gen5 slots 

[PCIe Switch directly]
– 8 x PCIe Gen5 x16 link (LP, HL)
[CPU directly]
–  1 x PCIe Gen5 x16 link (FH, HL)** + 1 x PCIe Gen5 x16 link (FH, HL)**
–  1 x PCIe Gen5 x8 link (FH, HL) + 1 x PCIe Gen5 x8 link (FH, HL)

**SupportPCIe x16 link for DPU

Storage

Optional Kits:
-Broadcom MegaRAID 9560-16i
-Broadcom MegaRAID 9540-8i

10 x 2.5” hot-swap drive bays (8 NVMe, 2 NVMe/SATA/SAS*)

[PCIe Switch directly]
Front: 8 NVMe
[CPU directly]
Rear: 2 NVMe(CPU2)/SATA(PCH)/SAS*

2 x M.2 Gen5 x4 link (CPU1) / 2 x M.2 Gen3 x2 link (PCH)

*SAS support required an HBA/RAID card.

Front I/O Ports

4 x USB3.2 Gen1 ports
1 x VGA port
2 x 10Gb RJ45 LAN module (Intel-x710 Based)
1 x Mgmt LAN
1 x locate button
1 x power button

Rear I/O Ports

1 x locate button
1 x power button

Power Supply

4+2 or 3+3 Redundant 3000W 80 PLUS Titanium Power Supply